Legacy

RVP-300plus & RVP-550

Previous-generation rapid vertical processors for 200–300mm wafers

Production-proven 300mm furnaces introduced in the world's first 300mm fab in 1999. Continuous refinement led to the RVP Ace. The layout provides for multiple systems with zero side spacing required due to innovative packaging, with excellent rear maintenance access. New RVP-300plus and RVP-550 are available brand new and refurbished (subject to donor availability).

specifications

RVP-300plus & RVP-550 at a glance

Next step

Discuss a RVP-300plus / RVP-550 configuration

Talk to a thermal processing specialist about process requirements, wafer formats and production volumes.