Versatility for 150–200mm
The AVP Ace is an advanced vertical batch furnace for 150 mm and 200 mm wafers. It delivers excellent process performance, optimized cost of ownership, and outstanding flexibility for diffusion, oxidation, and LPCVD applications. Building on proven process modules and an updated control architecture, the AVP Ace can be configured to meet specific production and engineering requirements.
An atmospheric diffusion process is a heat treatment in a mostly inert environment which distributes dopants in a silicon, GaAs, InP or other semiconductor wafer to a desired depth, changing the electrical properties of the semiconductor. Sometimes a reactive element such as oxygen is added, consuming silicon and converting it into silicon dioxide (SiO2) for use in many applications.
Low Pressure Chemical Vapor Deposition uses a chemical reaction to convert gas phase precursors into useful films. The products of that reaction are deposited on top of the wafer and therefore do not consume atoms from the base material.
Tempress offers furnace solutions for various other processes such as wafer splitting (SOI/POI) and polyimide curing, and is open to customise and co-develop specific thermal processes to fit your needs.