Specialty semiconductor production covers a broad range of devices manufactured outside the highest-volume logic and memory segments. These products often combine mature wafer sizes with demanding materials, long product lifecycles and application-specific process requirements.

Tempress supports specialty device manufacturers with configurable diffusion, oxidation, annealing and low-pressure deposition solutions. Horizontal and vertical batch platforms can be adapted to process requirements, wafer formats and production volumes, from process development and pilot lines through established manufacturing.

Power semiconductor devices handle high electrical currents or voltages with high efficiency. Diodes, thyristors, MOSFETs and IGBTs are essential to power transmission, renewable energy systems, industrial equipment and the electrification of transport.

Tempress provides the high-temperature process capability used to manufacture silicon and wide-bandgap power devices, including controlled oxidation, diffusion, annealing and deposited films. Our systems support process development and repeatable production on materials such as silicon, silicon carbide and gallium nitride.

Microelectromechanical systems typically contain structures between 1 and 100 micrometers and are widely used in accelerometers, gyroscopes, pressure sensors and other precision devices. Related manufacturing methods also create extremely small mechanical parts for applications such as high-end watchmaking.

For MEMS manufacturing, Tempress offers LPCVD silicon nitride, low-stress nitride, polysilicon and TEOS processes, together with surface treatment, PECVD, oxidation and annealing solutions. These process capabilities are used by established manufacturers and leading research institutes.

Semiconductor-based photonic devices can deliver higher speed, lower power consumption and new sensing capabilities. Current and emerging applications include fiber-optic communications, biochemical sensors, integrated optics and LiDAR.

Tempress furnace systems are used by internationally recognized institutes and manufacturers to develop and produce photonic devices. Available process solutions include low-loss silicon nitride, polysilicon, thick thermal oxide and carefully controlled annealing for optical layers and device structures.

Wafer manufacturers use thermal processing to improve substrate quality, create engineered layers and add value before device fabrication. Annealing, wet and dry oxidation and LPCVD polysilicon are important steps in the production of advanced silicon and compound-material wafers.

Tempress process solutions support the manufacture of silicon-on-insulator (SOI) and piezo-on-insulator (POI) wafers, including thermal treatments and splitting processes. These engineered substrates enable innovative device architectures in semiconductor, MEMS, photonics and radio-frequency applications.

Advanced packaging brings multiple dies, functions and materials together at wafer or package level. Wafer-level packaging, chiplets, interposers and three-dimensional integration require controlled films and thermal treatments without compromising completed device structures.

Tempress supports packaging flows with lower-temperature deposition, annealing and polyimide curing processes. Flexible batch platforms help manufacturers establish repeatable film properties and thermal budgets for passivation, dielectric, bonding and through-silicon-via related applications.

The Internet of Things connects physical objects and devices so that their condition, location and use can be measured and acted upon. Applications range from ultra-low-cost identification and supply-chain tracking to sensors and connectivity chips used in phones, vehicles and industrial systems.

Tempress provides scalable process steps for these cost-sensitive devices, including polyimide curing and the diffusion and deposition processes used in sensor, radio-frequency and connectivity components. Uniform batch processing supports dependable yield as products move from development to volume production.

Combining MEMS technology with surface chemistry enables molecular nanotechnology and microfluidic devices for life science, biotechnology and medical applications. These technologies are used in biosensors, diagnostic devices, lab-on-a-chip systems and advanced sequencing tools.

Tempress offers silanization and other surface treatments, LPCVD polysilicon and TEOS, PECVD silicon nitride and oxynitride, plus oxidation and annealing. These processes support the precise surfaces, channels, membranes and sensing structures required by research institutes and medical-device innovators.

Light-emitting diodes and related optoelectronic devices are built on compound-semiconductor and engineered substrates that demand stable, repeatable thermal processing. Applications span general lighting, displays, automotive systems, sensing, ultraviolet sources and optical communication.

Tempress furnace platforms support annealing, oxidation and deposition steps for LED process development and manufacturing. Flexible temperature control, atmosphere management and batch configurations help address sapphire, silicon and compound-semiconductor substrate requirements.

Thermal processing and conformal deposition create value beyond conventional semiconductor wafers. Applications include nano-materials that improve battery electrodes, functional coatings for filtration membranes and precision microstructures for high-end mechanical systems.

Tempress works with industrial and research partners to adapt diffusion, deposition and controlled-atmosphere heat treatment to new substrates and materials. This collaborative approach helps move emerging processes from laboratory development toward stable, scalable production.